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      Perfected techniques. 

      Front-end process technologies enable us to produce designed functions in the best possible way, and it plays an important role in the miniaturization, slimming down, and high functionality of electronic components.


      Laminating & stacking 永利皇冠登录


      Casting, high precision stacking and aligning, and laminating technology for up to sub-micron thickness dielectric sheets of uniform and small crystalline particles.    皇冠官网地址
         

      MLCC layer thickness reduction

      Printing 永利皇冠登录


      High precision printing technology utilizing screen and other printing techniques to form thin, dense structures such as internal electrodes and wiring on ceramic sheets.    皇冠登录地址
         

      Thin internal electrodes

      Sintering 永利皇冠登录



      Precise control of firing temperatures and atmosphere to produce desired crystal structures in electro ceramics.
         皇冠官网地址
           Before and after sintering

      Nano & thin film fabrication 永利皇冠登录


      Physical and chemical methods, including lithography and etching technologies, to form thin layers or films up to sub-micron levels.    皇冠登录地址
         

      Comb finger (MEMS technology)

      Surface finishing 永利皇冠登录



      Controlling of electrochemical parameters to treat and enhance mechanical and electrical surface properties of electrical components utilizing electroless deposition and electroplating technologies.
         永利皇冠游戏网站
         

      Metal surface control techniques

      Precision mechanical processing 永利皇冠登录


      High precision molding and shaping technology using injection molding, pressing and other mechanical techniques to create complex structures with high dimensional accuracy.    皇冠官网地址
         

      Injection molding with ceramic coumpounds

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